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Christoffelkruid 171
Vlaardingen, ZH 3137 Wr
06-61027455 *******
9. Finishing - the entire process of covering the pad areas by having a slim layer of solder to organize the board for the ultimate wave soldering or reflow soldering process that will occur at a later date after the components have been placed.

building with wire10. Silk Screening - the process of using the markings for component designations and component outlines to the board. Can be placed on simply the side that is top to both edges if elements are mounted on both top and bottom sides.

11. Routing - the process of isolating multiple panels from a panel of identical boards; this technique additionally allows cutting notches or slots into the board if needed.

12. Quality Control - a inspection that is visual of panels; also can end up being the means of inspecting wall quality for plated through holes in multilayer boards by cross-sectioning or other techniques.

13. electric Testing - the entire process of checking for continuity or shorted connections on the boards by means using a voltage between various points in the board and determining if your present flow does occur. Dependant on the board complexity, this method may require a especially designed test fixture and test program to incorporate with all the electric test system used by the board manufacturer.
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The panels will also be utilized to electrically connect the necessary leads for every single component using conductive copper traces. The component pads and connection traces are etched from copper sheets laminated onto a non-conductive substrate. Imprinted circuit panels were created as single sided with copper pads and traces on one side for the board only, double sided with copper pads and traces on the top and bottom sides associated with board, or multilayer designs with copper pads and traces on top and base of board by having a number that is variable of copper levels with traces and connections.

Single or double sided panels consist of a core dielectric product, such as FR-4 epoxy fiberglass, with copper plating on a single or both sides. This copper plating is etched away to form the copper that is actual and connection traces regarding the board surfaces included in the board manufacturing procedure. A multilayer board consists of the amount of layers of dielectric material that is impregnated with adhesives, and these levels are used to split up the levels of copper plating. A few of these layers are aligned after which bonded into a board that is single under temperature and pressure. Multilayer boards with 48 or maybe more levels can be produced with today's technologies.

The internal layers are often used to provide power and ground connections, such as a +5V plane layer and a Ground plane layer as the two internal layers, with all other circuit and component connections made on the top and bottom layers of the board in a typical four layer board design. Extremely board that is complex could have many layers to make the different connections for different voltage amounts, ground connections, or even for linking the numerous leads on ball grid array products along with other large integrated circuit package platforms.